LIGHT-CURABLE ADHESIVES FOR ELECTRONICS ASSEMBLY  
                 
  Incure offers a wide range of UV light-curable adhesives for electronics assembly. These UV light curing adhesives cure in seconds upon
exposure to ultraviolet light are suitable for LCD, OLED connector reinforcement, C-MOS connector, electronic component etc.


 
        
           
  Advantages of Incure Electronic Materials Learn about our Light Curing Systems:    
    Cure In Seconds C9000 / U8000 UV Light Curing Conveyor Systems  
    Solvent Free L9000 Compact UV LED Spot Curing Lamp  
    One Component, No Mixing S10 / S20 Ultra High Intensity Light-Curing Spot Lamp  

 


 

 

  Uni-Weld™ Series Core Products (Metal Bonder)  
  Product Product Highlights Substrates Color Viscosity Tensile (psi) Hardness Elongation  
  1283 Cures with UV / Visible / Heat or Actif 398. Good clarity, heat and moisture resistance. Good passive vibration isolation capability. Ideal for relays for circuit breakers in the electronics industry for outdoor use. High Performance
Metal / Glass / Ceramics
Clear 600 cps 5,700 to 9,800 D68 – D78 55%  
  1203 Cures tack-free with up to 5,400 PSI on many different metals / glass / ceramics. Very low linear shrinkage with enhanced excellent moisture and temperature resistance. Good passive vibration isolation capability. Metal / Glass / Ceramics Clear 700 cps 4,400 to 5,400 D59 – D69 400%  
  Uni-Weld™ Series Core Products (Plastic Bonder)  
  Product Product Highlights Substrates Color Viscosity Tensile (psi) Hardness Elongation  
  1462 Low viscosity, acid-free, multi-substrate / plastic bonder. For electronics industry. Good bonding strength on multiple substrates such as metals, glass and FR4 materials on a single application. Low Adhesion
Multi-Substrates
(High Strength Plastics)
Slightly Amber 450 cps 2,800 to 6,900 D49 – D59 827%  
  1483 Medium viscosity, acid-free, multi-substrate / plastic bonder. For electronics industry. Good bonding strength on multiple substrates such as metals, glass and FR4 materials on a single application. Low Adhesion
Multi-Substrates
(High Strength Plastics)
Slightly Translucent 1,150 cps 2,800 to 7,000 D55 – D65 915%  
  1063 Low viscosity, acid-free, multi-substrate / plastic bonder. For electronics industry. Good bonding strength on multiple substrates such as metals, glass and FR4 materials on a single application. Multi-Substrates
(High Strength Plastics)
Clear 2,500 cps 3,300 to 7,000 D58 – D68 380%  
  Uni-Weld™ Series Core Products (Potting)  
  Product Product Highlights Substrates Color Viscosity Tensile (psi) Hardness Elongation  
  3339 Very thick, low water absorption electronics sealant. Provides air-tight seal with ease of peel for rework. Tough yet elongating. Widely use for automotive and electronics industries for its low CTE properties. Very Low Strength
Multi-Substrates
Slightly Translucent 38,500 cps 1,100 to 3,400 A12 – A22 71%  
  6228HT Cost efficient epoxy-acrylate, thick viscosity, ultra-low shrinkage and water absorption potting compound for use in sensitive electronic devices. UV / Heat curable. Chemical and vapor resistance. Multi-Substrates
(Metal / Glass / Ceramics)
Clear 6,000 cps 1,700 to 5,600 D55 – D65 160%  
  6213 Cost efficient epoxy-acrylate low viscosity, ultra-low shrinkage and water absorption potting material for use in sensitive electronic devices. Chemical and vapor resistance. Low Adhesion
Multi-Substrates
Transparent 800 cps 2,200 to 2,700 D55 - D65 430%  
  Package Size: 10 ml syringe / 30 ml syringe / 30 ml squeeze bottle / 100 ml squeeze bottle / 250 ml squeeze bottle / 1 kg Bottle / 1 Gallon Pail / 2 Gallon Pail / 5 Gallon Pail