HIGH TEMPERATURE EPOXY FOR BONDING AND POTTING  
                             
  Incure High Temperature Epoxy Adhesives are designed for bonding and potting applications to 204°C.
These high temperature epoxies can be applied to a wide range of substrates, offering exceptional chemical, electrical and mechanical properties.
 
                             
    Eop-Weld  Series Core Products  
   

Product

 

Product Highlights

 
Bonding 

Color

 

Tensile Shear Strength

Flexural Strength

Viscosity

Cure Shrinkage

Temp. Resistance

 
            Substrates       psi psi cP (Mixed) in/in

°C 

 
    HTE-6418   Two-component epoxy (sealant and encapsulant) bonding material. 3 mins fast-setting, strength starts increasing after 15 mins, full cure in 72hrs. High gloss clear encapsulant, high temperature and chemical resistance.   Multi-Substrates
(High Strength) 
Clear   9,400 145,400

6,500

0.0005 -55 to 155  
    HTE-6481   High Performance, tough and glossy heat cure clear epoxy. Superior peel and shear strength on many substrates. Exceptional high temperature, vibration, impact and abrasion resistance. Dimensional stability, chemicals and solvents resistance.    Multi-Substrates
(High Strength)
 
Clear Glossy   21,600 137,500

7,000

0.0005 -55 to 155  
    HTE-6468   Two-component epoxy (sealant and encapsulant) bonding material. 3 mins fast-setting, strength starts increasing after 15 mins, full cure in 72hrs. High gloss black encapsulant, high temperature and chemical resistance.    Multi-Substrates
(High Strength)
 
Black Glossy   9,400 145,400

12,500

0.0005 -55 to 155  
    HTE-6498   Two-component epoxy (sealant and encapsulant) bonding material. 3 mins fast-setting, strength starts increasing after 15 mins, full cure in 72hrs. High gloss black encapsulant, high temperature and chemical resistance.     Multi-Substrates
(High Strength)
Clear   9,400 145,500

14,500

0.0005 -55 to 155  
    HTE-5354   Two-part epoxy system for bonding and potting applications requiring good flexibility operating at high temperatures. Bonds various substrates, delivers outstanding performance on application within the operating temperature range.    Multi-Substrates
Clear   1,200 8,000 12,000 0.008 -50 to 200  
    HTE-6491   High Performance, tough and glossy heat cure black epoxy. Superior peel and shear strength on many substrates. Exceptional high temperature, vibration, impact and abrasion resistance. Dimensional stability, chemicals and solvents resistance.     Multi-Substrates
(High Strength)
Black Glossy   21,600 137,500

23,000

0.0005 -55 to 155  
    HTE-5351   Two-part epoxy system for bonding and potting applications  operating at high temperatures. Bonds various substrates. Meets NASA outgassing requirements.   Multi-Substrates Amber   3,000 10,200 25,000 0.002 -65 to 204  
    HTE-5350   Two-part epoxy system designed for bonding and potting applications operating at high temperatures. Bonds various substrates, with exceptional chemical resistance. Outstanding performance within operating temperature range.    Multi-Substrates Grey   2,500 11,400 Paste 0.002 -65 to 204  
    HTE-5352   Two-part epoxy system for repair and maintenance of applications operating at high temperatures. Bonds various substrates.   Multi-Substrates Grey   2,500 12,000 Paste 0.002 -65 to 204  
    HTE-5355   Two-part epoxy system designed for bonding and potting applications operating at high temperatures. Bonds various substrates with exceptional chemical resistance. Outstanding performance within the -56°C to 2015°C temperature range. Meets NASA outgassing requirements.    Multi-Substrates Light Grey   2,350 11,800 Paste 0.004 -55 to 204  
    Package Size: Pint / Quart / Gallon        
                           
    HTE-5350 - for repairing defects in aluminum prior to powder coating.
HTE-5352 - for repairing defects in cast iron, stainless steel, and steel prior to powder coating.